SATO Yukihiro

Science and Technology, Innovation, Science Advisory System, Information Industry, Technology Diffusion

2023 Master of Philosophy in Industrial Systems Manufacture and Management, University of Cambridge, UK
2022 Master of Public Administration in Science, Engineering and Public Policy, University College London, UK
2012 Master of Engineering, Osaka University
2010 Bachelor of Engineering, Osaka University

2023 Deputy Director, Welfare Planning Office, Minister's Secretariat, METI
2020 Deputy Director, Policy Planning and Research Office, Trade Policy Bureau, METI
2017 Director, Regional Revitalisation Promotion Office, City of Kitakyushu
2016 Deputy Director, Nuclear Accident Response Office, Electricity and Gas Industry Department, METI
2015 Assistant Director, Human Resources Policy Office, Economic and Industrial Policy Bureau, METI
2013 Assistant Director, Fukushima Bureau of Reconstruction, Reconstruction Agency
2012 Industrial Science and Technology Policy and Environment Bureau, METI

• Sato, Y. and Arimoto, T. (2023) ‘Industrial Innovation Policy: Challenges and opportunities’, Cambridge Babbage Forum, pp. 1–18. Available at: https://ciip-group.org/media/uploads/files/Japan_Final.pdf
• Sato, Y. and Goenka, A. (2023) ‘How can SMEs play a greater role in tech adoption?’, Cambridge Industrial Innovation Policy. Available at: https://www.ciip.group.cam.ac.uk/reports-and-articles/how-can-smes-play-greater-role-tech-adoption/
• Sato, Y. (2017) ‘Countermeasures against contaminated water at the Fukushima Daiichi Nuclear Power Plant’, Japan Industrial Publishing, 59 (1), pp. 1–4.
• Yoneta, K., Sato, R., Iwata, Y., Atsumi, K., Okamoto, K., Sato, Y. and Shigemoto, T. (2014) ‘Study of extreme low temperature and load solid-phase Sn-Ag system bonding mechanism for 3D ICs’, 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, USA, 2014, pp. 2227-2230, doi: 10.1109/ECTC.2014.6897612.
• Yoneta, K., Sato, R., Iwata, Y., Atsumi, K., Okamoto, K., and Sato, Y. (2013) ‘Study of low load and temperature, high heat-resistant solid-phase Sn-Ag bonding with formation of Ag3Sn intermetallic compound via nanoscale thin film control for wafer-level 3D-stacking for 3D LSI’, 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, USA, 2013, pp. 2381-2384, doi: 10.1109/ECTC.2013.6575918.
• Yoneta, K., Sato, R., Iwata, Y., Atsumi, K., Okamoto, K., and Sato, Y. (2013) ‘Study of low load and temperature solid-phase Sn-Ag bonding with formation of high heat-resistant Ag3Sn intermetallic compound via nanoscale thin film control for wafer-level 3D-stacking for 3D LSI’, International Conference on Electronics Packaging, Osaka, Japan, 2013, pp. FA2-1.
• Sato, Y., Sato, R., Iwata, Y., Morinaga, E., Oka, Y., Yoneta, K., & Ota, T. (2012) ‘Study on micro-bonding method with temperature hierarchy for next-generation 3D-SiP’, Symposium on Microjoining and Assembly Technology in Electronics, 18th, pp. 33–38.
• Sato, R., Tsukada, A., Sato, Y., Iwata, Y., Murata, H., Sekine, S., Kimura, R., and Kishi, K. (2012) ‘Study on high performance and productivity of TSV’s with new filling method and alloy for advanced 3D-SiP’, 2011 IEEE International 3D Systems Integration Conference, Osaka, Japan, 2012, pp. 1-4, doi: 10.1109/3DIC.2012.6262946.
• Tsukada, A., Sato, R., Sekine, S., Kimura, R., Kishi, K., Sato, Y., Iwata, Y., & Murata, H. (2011) ‘Study on TSV with new filling method and alloy for advanced 3D-SiP’, 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, USA, 2011, pp. 1981-1986, doi: 10.1109/ECTC.2011.5898788.
• Sato, Y., Sato, R., Iwata, Y., Miyagawa, H., & Murata, H. (2010) ‘Basic study on micro-bonding method with temperature hierarchy for 3D-SiP’, Japan Welding Society, pp. 160-161, doi: 10.14920/jwstaikai.2010f.0.160.0.